Effect of Annealing Temperature on Photoluminescence Performance and Structure of Si-rich Silicon Nitride

Zheng-fang XIE,Wen-guang SHAN,Xiao-shan WU,Feng-ming ZHANG
DOI: https://doi.org/10.3788/fgxb20123307.0780
2012-01-01
Abstract:Silicon-rich silicon nitride film was deposited by plasma enhanced chemical vapor deposition (PECVD) on (100)-oriented monocrystalline silicon, according to silicon solar cell process. Photoluminescence (PL) performance of the films at annealing temperatures in N 2 ambient was studied, showing that temperatures had great effect on the characteristics. Excited by 325 nm line, PL from defect-related states was only observed in the film and Si clusters has not been formed at annealing temperature 900°C. After annealed at different temperature, PL intensity decreased with increasing temperature. PL peak originated from defect energy Si dangling bond (K center). In this work, At 900°C, disappearance of PL peak was attributed to increasing non-radiation recombination and silicon clusters has not been formed. Structure of silicon nitride has been measured by X-ray photo-electron spectroscopy (XPS) showing binding energy at 101.8 eV and indicated that silicon phase has not been separated from silicon nitride. Infrared (FTIR) measurement provided a good confirm to PL analysis.
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