Nitridation of Metalorganic-Chemical-VaporDeposited Al 2 O 3 Gate Dielectrics by NH 3 Annealing
min liu,j b cui,j g lv,z q sun,man zhang,j w zhang,x f chen,guangzhi he
DOI: https://doi.org/10.1166/sam.2014.1855
2014-01-01
Science of Advanced Materials
Abstract:Al2O3 high-k gate dielectric has been deposited onto a Si substrate by metalorganic-chemical-vapor-deposition (MOCVD) and then nitridized by NH3 annealing in a temperature range of 500-1000 degrees C. The effect of annealing temperature on the interfacial stability, morphology, and electrical properties of Al2O3/Si gate stack has been investigated. AFM analysis has indicated that uniform and smooth surface has been obtained by NH3 annealing. XPS measurements have confirmed that NH3 annealing leads to the formation of SiON interfacial layer and the nitridation of Al2O3 surface layer. Moreover, a decrease in band gap and valence band maximum with increasing annealing temperature has been detected. In addition, an optimized electrical performance based on Au/Al2O3/Si/AI CMOS capacitor has been obtained.