Low-resistivity Ni/Pt Ohmic contacts to p-type N-doped ZnO

Y.F. Lu,Z.Z. Ye,Y.J. Zeng,L.P. Zhu,J.Y. Huang,B.H. Zhao
DOI: https://doi.org/10.1016/j.sse.2010.03.012
IF: 1.916
2010-01-01
Solid-State Electronics
Abstract:Low-resistivity Ni/Pt Ohmic contacts to p-type N-doped ZnO were fabricated in this paper. Ni/Pt Ohmic contacts showed a lowest specific contact resistivity of 3.81×10−6Ωcm2 after 450°C annealing, which is lower than any other reported Ohmic contacts to p-type ZnO. The interface reactions during annealing and the Ohmic contact formation mechanism were investigated by secondary ion mass spectrometry measurements. The results showed that Ni out-diffused to react with Pt and Zn out-diffused a little, too. These interface diffusions as well as activation of N acceptors during annealing induced such a low specific contact resistivity.
What problem does this paper attempt to address?