The Mechanism of Void Formation in the Growth of 3C-Sic Thin Film on Si Substrate

YH Seo,KC Kim,HW Shim,KS Nahm,EK Suh,HJ Lee,YG Hwang,DK Kim,BT Lee
DOI: https://doi.org/10.4028/www.scientific.net/msf.264-268.199
1998-01-01
Abstract:The effect of growth parameters has been examined for the epitaxial growth of void-free SiC film on Si substrate. Void-free single crystalline SiC films were grown when the Si substrate was heated after the flow of TMS. The increase of TMS flow rate grew void-free SiC films, but the crystallinity of the films varied from single crystalline to polycrystalline with increasing TMS flow rates. The growth of void-free single crystalline SiC films was observed at substrate temperatures below 1000 degrees C. The mechanism of the void formation was briefly discussed in this work.
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