Deep Void Formation Mechanism in Si(100) During Its Carbonization Reaction with C2H2

Li Wang,Sima Dimitrijev,Jisheng Han,Jin Zou
DOI: https://doi.org/10.1016/j.tsf.2007.02.084
IF: 2.1
2007-01-01
Thin Solid Films
Abstract:Deep silicon voids, located several hundreds of nm below the Si-SiC interface, were observed in Si(100) crystal after its reaction with C2H2 at 1200 degrees C. Interface voids are commonly observed during the reaction between Si and carbohydrides, but the proposed mechanisms for the interface voids cannot explain the appearance of the deep Si voids. Based on the experimental results, a formation mechanism for the deep voids is proposed in this letter. The proposed mechanism identifies carbon diffusion into the Si crystal as the initial cause and makes a relationship to the fast cooling during the employed rapid-thermal processing. (C) 2007 Elsevier B.V. All rights reserved.
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