Growth and Mechanical Properties of Amorphous and Nanostructured SiC films

王新华
DOI: https://doi.org/10.3969/j.issn.1672-7126.2004.03.004
2004-01-01
Abstract:High-quality amorphous and nano-crystalline silicon carbide films were deposited by thermal plasma physical vapor deposition (TPPVD) of SiC ultra fine powder. The films were characterized with high resolution transmission electron microscopy (HRTEM), scanning electron microscopy (SEM) X-ray diffraction (XRD) infrared Fourier transform (FITR) and X-ray photoelectron spectroscopy (XPS). The results show that at a substrate temperature lower than 600°C and a powder feeding rate less than 20 mg/min, amorphous SiC film grows with a maximum deposition rate of 25 nm/s, whereas at a substrate temperature ranging from 600°C to 1000°C, nano-crystalline SiC films, with grain size of 3 nm- 15 nm, grow at a maximum deposition rate of 230 nm/min. The hardness of the amorphous and nano-crystal SiC films was found to be 33.8 and 38.6 GPa, respectively.
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