Thermal Diffusion Effect of Self-Assembled Ge Quantum Dots Probed by Fluorescence X-ray Absorption Fine Structure

PAN Zhi-yun,WANG Ke-fan,LIU Jin-feng,XU Peng-shou,SUN Zhi-hu,YAN Wen-sheng,WEI Shi-qiang
DOI: https://doi.org/10.3969/j.issn.0253-2778.2007.04.038
2007-01-01
Abstract:The fluorescence X-ray absorption fine structure(XAFS) technique was used to study the diffusion effect of self-assembled Ge/Si(001) quantum dots grown by molecular beam epitaxy(MBE).The atomic force microscopy(AFM) image shows that Ge quantum dots with high area density of 5.2×1011 cm-2 are grown at the substrate temperature of 550 ℃.The XAFS result shows that the annealing treatment at 550 ℃ for the Si-capped Ge quantum dots can hardly affect the thermal diffusion between Ge and Si atoms.With the annealing temperature increasing from 550 ℃ to 800 ℃,a drastic change of local structure around Ge atoms can be observed.The coordination numbers of the nearest Ge-Si pair increase from 3.3 to 3.8,and the Debye-Waller factor decreases from 4.0 to 2.9×10-5 nm2.This indicates that the Ge atoms have been dominantly surrounded by Si atoms and that the annealing at high temperatures observably increases the diffusion of Ge atoms from the quantum dots into the Si capping layer.
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