Abstract:As the demands for improved performance of integrated circuit (IC) chips continue to increase, while technology scaling driven by Moore’s law is becoming extremely challenging, if not impractical or impossible, heterogeneous integration (HI) emerges as an attractive pathway to further enhance performance of Si-based complementary metal-oxide-semiconductor (CMOS) chips. The underlying basis for using HI technologies and structures is that IC performance goes well beyond classic logic functions; rather, functionalities and complexity of smart chips span across the full information chain, including signal sensing, conditioning, processing, storage, computing, communication, control, and actuation, which are required to facilitate comprehensive human–world interactions. Therefore, HI technologies can bring in more function diversifications to make system chips smarter within acceptable design constraints, including costs. Over the past two decades or so, a large number of HI technologies have been explored to increase heterogeneities in materials, technologies, devices, circuits, and system architectures, making it practically impossible to provide one single comprehensive review of everything in the field in one paper. This article chooses to offer a topical overview of selected HI structures that have been validated in CMOS platforms, including a stacked-via vertical magnetic-cored inductor structure in CMOSs, a metal wall structure in the back end of line (BEOL) of CMOSs to suppress global flying noises, an above-IC graphene nano-electromechanical system (NEMS) switch and nano-crossbar array electrostatic discharge (ESD) protection structure, and graphene ESD interconnects.

Challenges: ESD Protection for Heterogeneously Integrated SoICs in Advanced Packaging

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On the ESD Protection and Non-Fatal ESD Strike on Nano CMOS Devices

An Overview of ESD Protection in Nanometer IC

Recent Advances in Monolithic Integration of Diverse Technologies with Si CMOS

On Chip Electrostatic Discharge Protection for MEMS Gas Sensor System

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

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A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Nano enabled 3D integration of on-chip ESD protection for ICs

On-Chip ESD Protection Design for Ics

Evaluation of RF electrostatic discharge (ESD) protection in 0.18-μm CMOS technology

Heterogeneous integration of nano enabling devices for 3D ICs

Whole-Chip ESD Protection Design for Deep Submicron Mix-Signal CMOS VLSI

Recent Advances in Electromagnetic Compatibility of 3D-Ics — Part II

On-chip ESD Protection Design for Integrated Circuits: an Overview for IC Designers

Selective Overview of 3D Heterogeneity in CMOS

A Systematic Study of ESD Protection Co-Design with High-Speed and High-Frequency ICs in 28 Nm CMOS.

Mixed-mode simulation-design for IEC-ESD protection

US Microelectronics Packaging Ecosystem: Challenges and Opportunities

Electromigration in three-dimensional integrated circuits