Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Er-Ping Li,Xing-Chang Wei,Andreas C. Cangellaris,En-Xiao Liu,Yao-Jiang Zhang,Marcello D'Amore,Joungho Kim,Toshio Sudo
DOI: https://doi.org/10.1109/temc.2010.2048755
IF: 2.036
2010-01-01
IEEE Transactions on Electromagnetic Compatibility
Abstract:The ever-increasing demands of digital computing and wireless communication have been driving the semiconductor technology to change with each passing day. Modern electronic systems integrate more complex components and devices, which results in a very complex electromagnetic (EM) field environment. EM compatibility has become one of the major issues in ICs redesign, mainly due to the lack of effi...
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