Advanced Parallel Algorithm for System-Level EMC Modeling of High-Speed Electronic Package

Er-Ping Li,X. C. Wei,En-Xiao Liu,Zaw

DOI: https://doi.org/10.1109/isemc.2008.4652145

2008-01-01

Abstract:This paper presents a novel algorithm for EMC simulation of electronic package integration. This algorithm is based on hybridizing method of moments with analytical method, modal expansion technique. The entire electronic package domain is divided into two networks: the signal distribution network and the power distribution network. The signal distribution network is simulated using the method of moments, where the equivalent RLCG (resistance, inductance, capacitance and conductance) parameters of the signal traces in the signal layers are extracted. The power distribution network is simulated by using the modal expansion technique, where the equivalent circuit of the power distribution network is obtained. It is straightforward to substitute all the extracted equivalent circuit parameters into a SPICE-like simulator to simultaneously perform the signal and power integrities analyses. With the proposed method, the system-level EMC modeling of the package can be performed efficiently. Numerical examples demonstrate that this approach is able to provide fast yet accurate simulation for signal and power integrities analysis of multilayered electronic packages. In order to further enhance the simulation efficiency, the parallel process of the proposed method is implemented in our institutepsilas high performance computer.