Parallel Simulation of Electromagnetic and Thermal Characteristic in RF Component

GuoDong Zhu,Jie Tong,DaWei Wang,Jing Jin,Jun Hu,Z. G. Zhao,G. R. Li,Wen-Yan Yin
DOI: https://doi.org/10.1109/edaps.2017.8277057
2017-01-01
Abstract:Electrical-thermal co-simulation based on finite element method and massively parallel scheme which can perform on a supercomputer is proposed. Accuracy of the in-house high-performance computing scheme is validated by comparing the simulated results with commercial software. Then, a high frequency microstrip filter in system in package is analyzed by the proposed scheme.
What problem does this paper attempt to address?