Abstract:In this article, we present an efficient transient electromagnetic–thermal co-simulation solver based on the hybrid implicit–explicit finite-difference time-domain (HIE-FDTD) method. This solver is designed to model the multiscale structure and multiphysics field effects of 3-D microwave integrated circuits (ICs). For the first time, we introduce the HIE-FDTD method to solve the heat conduction equation and establish a unified 3-D electromagnetic–thermal co-simulation framework based on the HIE-FDTD algorithm. In addition, this article provides a detailed explanation of the thermal continuity condition, which is rooted in the principle of energy conservation. It addresses the significant variation in thermal conductivity among the different layers of advanced package structures and highlights the potential for substantial errors if the thermal continuity condition is not considered. The stability condition of the proposed method is also given. Numerical results demonstrate that the proposed algorithm achieves the same level of calculation accuracy as the COMSOL software. Thanks to the incorporation of the HIE-FDTD algorithm, our approach significantly enhances computational efficiency compared to the traditional FDTD method and COMSOL software. Furthermore, the proposed algorithm holds the potential for applications in electromagnetic compatibility (EMC) assessments and signal/power integrity (SI/PI) evaluations in radio frequency ICs (RFICs) and advanced packaging.

Electromagnetic-Thermal Co-simulation of Microstrip Filter

Parallel Simulation of Electromagnetic and Thermal Characteristic in RF Component

Electromagnetic-Circuital-Thermal Co-Simulation for Integrated Circuits and Microwave Applications

Transient Electromagnetic-thermal Co-Simulation Based on DGTD Method

Electromagnetic-Circuital-Thermal Multiphysics Simulation Method: A Review

Hybrid FDTD Method for Studying Electromagnetic Coupling Effects of Transmission Line Networks

Electrothermal Co-Simulation of A Two-Chip Power Delivery Network in Frequency Domain

Large-Scale Parallel DGTD and FETD Method for Transient Microwave Heating

Parallel Higher Order DGTD and FETD for Transient Electromagnetic-Circuital-Thermal Co-Simulation

Finite Element Simulation of Electromagnetic Properties of Ferrite Material

Thermal-Fluid Co-Simulation and Modelling of IGBT with Thermal Resistance Network

A Scalable HPC-Based Domain Decomposition Method for Multiphysics Modeling of RF Devices

Electromagnetic-Thermal Characterization Of On On-Chip Coupled (A)Symmetrical Interconnects

Transient Electromagnetic–Thermal Co-Simulation of Microwave/RF Integrated Circuits by the HIE-FDTD Method

Compact Microstrip Tri-Section Bandpass Filters with Mixed Couplings

Lumped-Network FDTD Method for Simulating Transient Responses of RF Amplifiers Excited by Intentional Electromagnetic Interference Signals

Numerical simulation of coupled transient thermal and electromagnetic fields with the finite integration method

Electrical–Thermal Cosimulation of Coaxial TSVs with Temperature-Dependent MOS Effect Using Equivalent Circuit Models

Electrical-Thermal Co-Simulation For Through Silicon Via And Active Tier In 3-D Ic

Finite-difference Time-Domain Macromodel for Simulation of Electromagnetic Interference at High-Speed Interconnects

A Novel Method to Simulate the Electromagnetic Susceptibility Problem