Abstract:It is well-known that both Performance and reliability of present-day RF integrated circuits (RFICs & MMICs) and even Nano electronic devices cannot be completely understood or accurately predicted from electromagnetic considerations alone. For example, the performance parameters, such as S-parameters, power handling capability and breakdown thresholds of high-density nano interconnects and RF modules are often affected by heat conduction and mechanical stresses/deformations, in extreme cases leading to electro-thermo-mechanical breakdown. Under such circumstances, predictive simulations must rely on multiphysics computational approaches as opposed to electromagnetics-only methods. There exist many challenges in developing computational algorithms for rapidly and accurately analyzing electro-thermal and electro-thermo-mechanical phenomena in RF as well as nano electronic components and circuits with complex geometries and new material properties. Most material parameters involved, such as carrier mobility, permittivity, permeability, electrical conductivity, thermal conductivity, and thermal expansion coefficients are applied field, temperature, and thermal stress dependent. On the other hand, there exist significant differences in length and time scales among electrical, thermal, and mechanical field actions. Therefore, special attention must be paid to the choice of spatial discretization and time stepping procedures to ensure convergent multiphysics solutions. This talk will address challenges and opportunities in computational multiphysics method and its application for RF and Nano electronics, with a series of examples given and demonstrated for the capability of time-domain finite element method and its implementation.

Electromagnetic-Circuital-Thermal Multiphysics Simulation Method: A Review

Electromagnetic-Circuital-Thermal Co-Simulation for Integrated Circuits and Microwave Applications

Computational Multiphysics Method for Rf and Nano Electronics: Challenges and Opportunities

Parallel Simulation of Electromagnetic and Thermal Characteristic in RF Component

Electromagnetic-Thermal Co-simulation of Microstrip Filter

Machine Learning Methodology Review for Computational Electromagnetics

A Scalable HPC-Based Domain Decomposition Method for Multiphysics Modeling of RF Devices

From computational electromagnetics to multiphysics methods and their applications

Multiphysics Computing of Challenging Antenna Arrays under a Supercomputer Framework

Transient Electromagnetic-thermal Co-Simulation Based on DGTD Method

Electromagnetic–Thermo–Mechanical Coupling Behavior of Cu/Si Layered Thin Plate under Pulsed Magnetic Field

Parallel Multiphysics Simulation for Characterizing Performance Degradation of RF Components

Electromagnetic-Thermal Co-simulation of Large Antenna Array on Platform Using Enhanced Finite Element Solver with Massively Parallel Computing Capability

An Efficient Domain Decomposition Method in Multi-physics Simulation of Package Systems

COMPUTATIONAL INVESTIGATION OF NANOSCALE SEMICONDUCTOR DEVICES AND OPTOELECTRONIC DEVICES FROM THE ELECTROMAGNETICS AND QUANTUM PERSPECTIVES BY THE FINITE DIFFERENCE TIME DOMAIN METHOD (INVITED REVIEW)

Multiscale modeling and simulation methods for electromagnetic and multiphysics problems

An efficient hybrid simulation technique for modeling the electromagnetic field propagation in a closed environment

A Novel Integrated Approach for Simulation of Electromagnetic Susceptibility Problem

Multiphysics Characterization of Large-Scale Through-Silicon-via Structures

Electromagnetic-Thermal Coupling Simulation by ANSYS Multiphysics of Induction Heater

Exploring Thermal Interface Materials for Electronics Via Molecular Dynamics Simulations: A Review