Recent Advances in Electromagnetic Compatibility of 3D-Ics — Part II

Etienne Sicard,Wu Jianfei,R. J. Shen,Er-Ping Li,En-Xiao Liu,J. Kim,Jonghyun Cho,Madhavan Swaminathan
DOI: https://doi.org/10.1109/memc.2016.7477137
2016-01-01
IEEE Electromagnetic Compatibility Magazine
Abstract:This second part addresses a selection of topics related to Electromagnetic interference (EMI) issues in three-dimensional integrated components. Details about Through Silicon Via TSV) technology, modelling and parasitic effects are introduced in the first part, then key concepts such as signal integrity (SI), power integrity (PI), and Electromagnetic Interference are introduced.
What problem does this paper attempt to address?