A Semi-Analytical Approach for System-Level Electrical Modeling of Electronic Packages with Large Number of Vias
Zaw,En-Xiao Liu,Er-Ping Li,Xingchang Wei,Yaojiang Zhang,Mark Tan,Le-Wei Joshua Li,Ruediger Vahldieck
DOI: https://doi.org/10.1109/tadvp.2008.923379
2008-01-01
IEEE Transactions on Advanced Packaging
Abstract:This paper presents a semi-analytical approach for electrical performance modeling of complex electronic packages with multiple power/ground planes and large number of vias. The method is based on the modal expansion technique and the method of moments. For the inner package domain with multiple power/ground planes and many vias, the modal expansion method is employed to compute the electromagnetic fields from which the multiport network parameters, e.g., the admittance matrix can be easily obtained. For the top/bottom domain of signal layers, the moment method is used to extract the equivalent resistance, inductance, capacitance, and conductance (RLCG) parameters. The equivalent circuit for the entire package is then generated by combining the results. for both package domains. The equivalent circuit can be used in a SPICE-like simulator to study the signal and power integrity of an electronic package. Numerical examples demonstrate that the new approach is able to provide fast yet accurate signal and power integrity analysis of multilayered electronic packages.