US Microelectronics Packaging Ecosystem: Challenges and Opportunities

Rouhan Noor,Himanandhan Reddy Kottur,Patrick J Craig,Liton Kumar Biswas,M Shafkat M Khan,Nitin Varshney,Hamed Dalir,Elif Akçalı,Bahareh Ghane Motlagh,Charles Woychik,Yong-Kyu Yoon,Navid Asadizanjani

2023-10-31

Abstract:The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more features into the silicon footprint. One promising approach is Heterogeneous Integration (HI), which involves advanced packaging techniques to integrate independently designed and manufactured components using the most suitable process technology. However, adopting HI introduces design and security challenges. To enable HI, research and development of advanced packaging is crucial. The existing research raises the possible security threats in the advanced packaging supply chain, as most of the Outsourced Semiconductor Assembly and Test (OSAT) facilities/vendors are offshore. To deal with the increasing demand for semiconductors and to ensure a secure semiconductor supply chain, there are sizable efforts from the United States (US) government to bring semiconductor fabrication facilities onshore. However, the US-based advanced packaging capabilities must also be ramped up to fully realize the vision of establishing a secure, efficient, resilient semiconductor supply chain. Our effort was motivated to identify the possible bottlenecks and weak links in the advanced packaging supply chain based in the US.

Systems and Control,Cryptography and Security

What problem does this paper attempt to address?

The paper attempts to address the challenges and opportunities faced by the U.S. microelectronics packaging ecosystem in the context of technological transitions in the semiconductor industry. Specifically, the paper focuses on the following aspects:

1. **Demand for Advanced Packaging Technologies**: As traditional methods of shrinking device sizes and reducing costs reach their limits, chip designers are seeking new technological solutions to improve cost-effectiveness and increase functionality on silicon wafers. Heterogeneous Integration (HI) is a promising approach that integrates independently designed and manufactured components through advanced packaging technologies. However, adopting HI brings design and security challenges.

2. **Supply Chain Security Issues**: Most outsourced semiconductor assembly and test (OSAT) facilities are located overseas, raising concerns about the security of the advanced packaging supply chain. To meet the growing demand for semiconductors and ensure a secure supply chain, the U.S. government is working to relocate semiconductor manufacturing facilities domestically. However, the U.S. also needs to enhance its advanced packaging capabilities to achieve the vision of a secure, efficient, and resilient semiconductor supply chain.

3. **Current Issues in the U.S. Advanced Packaging Ecosystem**: Although the U.S. has some production capacity in traditional packaging, it only holds a 3% share of the global advanced packaging market. Therefore, enhancing domestic advanced packaging capabilities is a crucial step in ensuring the security of the semiconductor supply chain.

4. **Economic and Business Development**: The paper also explores the economic and business development issues related to relocating advanced packaging operations to the U.S., including current business development initiatives and future directions.

In summary, the main goal of the paper is to analyze the current state of the U.S. domestic advanced packaging ecosystem and propose possible countermeasures to mitigate hardware security issues in the current advanced packaging supply chain, thereby ensuring the security and stability of the semiconductor supply chain.