Electromigration Aware Design For Nano-Packaging

X. Zhu,Hiren R. Kotadia,S. Xu,Hua Lu,Samjid Mannan,Chris J. Bailey,Y. C. Chan
DOI: https://doi.org/10.1109/NANO.2013.6720970
2013-01-01
Abstract:The physical phenomenon electromigration (EM) and computer simulation methods of EM in microelectronics devices have been reviewed. A multi-physics EM simulation method which can be used to predict voids appearance in conductors has been described and its relevant challenges have been discussed. The optimizing methods for nano-packaging are discussed in this work and shunt structure for solder joint is proposed and been verified to have a significant potential to resist EM by our model.
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