Abstract:This paper presents a hybrid modelling approach that combines physics-based electromigration modelling (PEM) and statistical methods to evaluate the electromigration (EM) limits of nano-interconnects in mesh networks. The approach, which is also compatible with standard Place and Route (P&R) tools and practises, takes into account the positive impact of network redundancy on EM current limits. The numerical simulations conducted in this study show that conventional methods underestimate the EM current limits of a power delivery network (PDN) unit-cell by 80% due to their lack of consideration for redundancy. Additionally, the time-to-failure (TTF) distributions of a PDN unit-cell obtained by the developed modelling framework adhered to a lognormal distribution, where the lognormal sigma, σlogn, exhibits a 55% reduction compared to that of the single constituent interconnects. The study also found the negative voltage (i.e., ground or Vss) grid to be more susceptible to EM than the positive voltage, i.e., Vdd grid. In the examined grid unit-cell design, both the number of interconnect sites prone to voiding and also the magnitude of the peak tensile stress within the nano-interconnects were found to be two times as high in the Vss case compared to Vdd. The lognormal sigma of TFF for the grid unit-cells, σlogn-tile, show a marked reduction compared to the lognormal sigma of the constituent single interconnects, σlogn, with a 50% and 66% decrease compared to single interconnects, for downstream (Vss) and upstream (Vdd), respectively. In addition, σlogn-tile was three times higher for downstream (Vss) compared to upstream (Vdd), whilst, in contrast, this difference was only 2-fold at the single interconnect level. TTF50% was predicted to be 4.13-fold higher at the grid unit-cell level for the upstream compared to downstream operation, which was also more pronounced than in the single interconnect level where the difference was only 2-fold. This research provides valuable insights into the EM ageing of nano-interconnects in mesh networks and could pragmatically enhance the accuracy of EM compliance evaluation methods.

Physics-based Electromigration Modeling and Assessment for Multi-Segment Interconnects in Power Grid Networks.

Computational Analysis of Mechanical and Electromigration Reliability Problems

Fast Physics-Based Electromigration Analysis for Full-Chip Networks by Efficient Eigenfunction-Based Solution

Fast Physics-Based Electromigration Analysis for Multi-Branch Interconnect Trees

A new prediction methodology for electromigration-induced solder degradation in a WL-CSP system

Transient Electrothermal Analysis of Multilevel Interconnects in the Presence of ESD Pulses Using the Nonlinear Time-Domain Finite-Element Method

Temperature-Aware Electromigration Analysis with Current-Tracking in Power Grid Networks.

Analytical Post-Voiding Modeling and Efficient Characterization of EM Failure Effects under Time-Dependent Current Stressing

A Power Grids Electromigration Analysis with Via Array Using Current-Tracing Model

Electro-Thermo-Mechanical Investigation On Multi-Level Interconnects In The Presence Of An Esd Pulse

Fast and Accurate Electromigration Analysis of Multi-Segment Wires

An Adaptive Electromigration Assessment Algorithm for Full-chip Power/Ground Networks

Simulation on Microstructural Evolution under Electromigration in Backside Power Delivery Network

Comparison of the Time-Dependent Physical Processes in the Electromigration of Deep Submicron Copper and Aluminum Interconnects

Physics-Based Model for Understanding Electromigration-Induced Cavity Evolution in Advanced Narrow Line Copper Interconnects

A Physics-Based Electromigration Reliability Model for Interconnects Lifetime Prediction

Phase-Field-Crystal Model for Electromigration in Metal Interconnects.

Physics-Informed Learning Based Multiphysics Simulation for Fast Transient TSV Electromigration Analysis

A Linear-Time Algorithm for Steady-State Analysis of Electromigration in General Interconnects

A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects

Electromigration in Nano-Interconnects: Determining Reliability Margins in Redundant Mesh Networks Using a Scalable Physical-Statistical Hybrid Paradigm