Survey on Fatigue Life Prediction of BGA Solder Joints
Baojun Qiu,Jingang Xiong,Han Wang,Shuai Zhou,Xiuding Yang,Zhengpei Lin,Maolin Liu,Nian Cai
DOI: https://doi.org/10.3390/electronics11040542
IF: 2.9
2022-02-11
Electronics
Abstract:With the development of science and technology, consumers’ requirements for various electronic devices present a trend of more diverse functions and thinner bodies. This makes integrated circuits mounted in electronic products and their packaging more vital to satisfying the above requirements. Ball grid array (BGA) packaging is widely used in the field of microelectronic manufacturing industries due to its multiple I/O volumes and excellent electric characteristics. However, due to environmental loads such as vibration and impact during its production and application, defects inevitably emerge in BGA solder joint defects, which will lead to the failure of electronic products. This article summarizes the state-of-the-art research on the factors, analysis methods, and models for the fatigue failure of BGA chips. After rigorous discussions concerning this research, some theoretical suggestions are provided for BGA packaging in reliability analysis and the establishment of evaluation standards.
engineering, electrical & electronic,computer science, information systems,physics, applied