Characterization and measuring methods on the high-cycling fatigue behavior of SnPb solder joint

Wang Xi-Shu,Yan Cheng-Kun,Zhao Hai-Yan

DOI: https://doi.org/10.3321/j.issn:0469-5097.2009.02.003

2009-01-01

Abstract:Electric circuits or packages in the large-scale integrated circuits and micro electro-mechanical systems are subjected to various effects of environmental conditions,such as mechanical or thermal fatigue impact loading etc.Therefore,the reliable evaluation technique of electric circuit is necessary to obtain enough experimental data of durability and reliability.The prediction of fatigue life,especially high-cycling fatigue life,of a solder joint is one of the most difficult problems in electronic industry.Successful fatigue life prediction of a solder joint depends on the ability of the modeling solder joint accurately.All accurate models have to be validated by experiments and practical applications.In this work,the experimental investigation and simulating analysis for the SnPb solder joint(SMT type)were carried out based on the scanning electron microscopy(SEM)in-situ technology.These results indicate that the fatigue crack initiation occurs at the heel or toe of SnPb solder joint,the fatigue crack propagates along about 20～45° titled to applied stress direction in substrate and the fatigue crack propagation has a small deflection to the applied stress direction with increasing of applied stress.At the same time,the fatigue crack propagation length is limited to within 150 μm because it is dependence on the geometrical size of solder joint.In addition,the response relation in solder alloy to applied stress in substrate was obtained based on the finite element(FE)analysis.Therefore,the prediction of fatigue life of solder joint was proposed based on the experimental data and simulation analysis and predication results agree good with the experimental data including to other literature.