Whole-Chip ESD Protection Design for Deep Submicron Mix-Signal CMOS VLSI

Ji Zongjiang,Li Dongmei
DOI: https://doi.org/10.3969/j.issn.1003-353x.2009.05.029
2009-01-01
Abstract:The design of robust ESD circuits remains challenging because ESD failure mechanisms become more acute as critical circuit dimensions continue to shrink.An ESD protection system for deep submicron chips was designed using a systematic view.After every power domain was protected separately,crosscoupled ESD diodes were used to connect the isolated power domain grounds.The problems existed in traditional output ESD protections were analyzed,moreover,an output ESD protection was designed in a safe manner.With smaller area,this structure enhances the whole-chip ESD resistance capability and achieves the design purpose.The prototype test chip is fabricated in a TSMC 0.18 μm CMOS technology,the test result verifies the efficiency of the ESD design.
What problem does this paper attempt to address?