A Study of Process/device/layout Co-Design for Full-Chip ESD Protection in BCD Technology

Rui Zhu,Fei Yao,Shijun Wang,Albert Wang,Liji Wu,Xiangmin Zhang,Baoyong Chi
DOI: https://doi.org/10.1109/icsict.2012.6467756
2012-01-01
Abstract:A study of process-device-layout co-design procedure for full-chip electrostatic discharge (ESD) protection design for high-voltage (HV) ICs in a Bipolar-CMOS-DMOS (BCD) technology is reported. The full-chip ESD protection scheme includes I/O and power clamp ESD protection. Co-design using mixed-mode TCAD ESD simulation technique ensures design optimization and prediction. Test result confirms full-chip ESD protection of at least 4.5K V.
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