Design and Analysis of Full-Chip HV ESD Protection in BCD30V for Mixed-Signal ICs.

Shijun Wang,Fai Yao,Li Wang,Rui Ma,C. Zhang,Z. Y. Dong,Albert Wang,Zitao Shi,Yuhua Cheng,Baoyong Chi,Tianling Ren
DOI: https://doi.org/10.1109/iscas.2013.6572032
2013-01-01
Abstract:We report design and analysis of full-chip ESD protection solution for high-voltage (HV) mixed-signal ICs in a BCD30V technology by mixed-mode ESD simulation involving integrated process, device, circuit and layout co-design. The full-chip HV ESD protection scheme includes both I/O and power clamp ESD protection. Mixed-mode ESD simulation technique enables pre-Si ESD design optimization and prediction. ESD measurements confirm full-chip HV ESD protection of >4.5KV for the whole chip. This design technique can be applied to practical full-chip HV ESD protection circuit design for mixed-signal ICs in various HV BCD technologies.
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