Nano enabled 3D integration of on-chip ESD protection for ICs

li wang,chen zhang,zongyu dong,rui ma,xin wang,zitao shi,hui zhao,jian liu,fei lu,albert wang,yuhua cheng
DOI: https://doi.org/10.1109/NANO.2013.6720875
IF: 3.5
2013-01-01
Nanotechnology
Abstract:This paper reviews recent advances in 3D on-chip electrostatic discharge (ESD) protection design for integrated circuits (IC). Traditional ESD protection relies on PN-junction-based structures, which have inherent disadvantages including fixed ESD triggering and parasitic effects. New ESD protection mechanisms and structures, including nano crystal dots and nano crossbar concepts, provide alternative non-traditional ESD protection solutions enabling post-Si field programmable and above-IC ESD circuit designs. The new ESD protection concepts represent a paradigm change in ESD protection designs and are potential solutions to next-generation nano circuits and systems.
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