Abstract:Bismuth telluride-based thermoelectric generators (TEG) were widely used in waste heat recovery, but the failure problem at the electrode interface was serious, which was related to the severe diffusion between Sn and Bi 2 Te 3 . However, the diffusion behavior and process have not been reasonably evaluated and mechanism analyzed, which was not conducive to the design and improvement of TEGs. In this work, hot-end electrode aging was performed at 150 °C, and the diffusion, intermetallic compounds (IMC), as well as crack induction between Bi 2 Te 3 and Sn-based solder were systematically investigated. It was found that the interdiffusion of Sn and Te atoms led to the formation of Bi 2 Te with HCP structure and SnTe with FCC structure at the interface. Bi 2 Te was a Bi-rich layer formed after the migration of Te atoms away from Bi 2 Te 3 , and SnTe had a double-layer structure respectively attributing to the diffusion of Sn and Te atoms. Diffusion-induced cracks tended to occur at Bi 2 Te/SnTe interfaces and SnTe/Sn interfaces. The former was related to the diffusion-induced phase transformation at the diffusion front of Sn atoms, while the latter generated from the initiation and expansion of Kirkendall voids. In addition, the brittleness of the Bi-rich phase aggravated the crack propagation. The shear test results of the electrodes confirmed that these cracks were the weakness of TEG electrodes. It was recommended to introduce a barrier layer at the interface to provide protection, and the fabrication of direct soldering was not suggested.

Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System

Ni barrier in Bi2Te3-based thermoelectric modules for reduced contact resistance and enhanced power generation properties

Interfacial Reactions between Sn-Based Solders and n-Type Bi2(Te,Se)3 Thermoelectric Material

Interfacial Stability in Bi2Te3 Thermoelectric Joints

Microstructural evolution and failure mechanism dominated by Bi, Sb cooperative diffusion at p-type thermoelectric pillar Bi-Sb-Te/Sn interface

Screening metal diffusion barriers for thermoelectric Bi0.5Sb1.5Te3

Extremely Low Contact Resistivity of Bi 2 Te 3 -Based Modules Enabled by NiP-Based Alloy Barrier

Structural stability of thermoelectric diffusion barriers: Experimental results and first principles calculations

Electromigration reliability and activation energy of Bi 2 Te 3 thermoelectric film

Diffusion bonding at the interface of Bi2Te3 thermoelectric modules

Effect of NiMo Diffusion Barrier Plating Preparation on Microstructure and Properties of Bi2Te3/Cu Joints

EFFECT OF OPERATING TEMPERATURE ON INTERFACE DIFFUSION AND POWER GENERATION OF BISMUTH TELLURIDE THERMOELECTRIC MODULES

Interfacial Reaction and Shear Strength of SnAgCu/Ni/Bi 2 Te 3 -Based TE Materials During Aging

Effects of chemical intermixing on electrical and thermal contact conductances at metallized bismuth and antimony telluride interfaces

Interfacial Reaction and Shear Strength of SnAgCu/Ni/Bi2Te3-Based TE Materials During Aging

Thermoelectric Transport Performance in p-Type AgSbTe 2 -Based Materials through Entropy Engineering

Effect of Plating Layers on the Bonding Strength of p-Type Bi-Te Thermoelectric Elements

Effect of Ni doping on thermoelectric properties of Ag2Te-Cu2Te composite material

A Combinatorial Approach to Microstructure and Thermopower of Bulk Thermoelectric Materials: the Pseudo-Ternary PbTe–Ag2Te–Sb2Te3 System

Evidences for diffusion-induced phase evolution and crack generation of intermetallic at Bi 2 Te 3 /Sn interface of thermoelectric generator electrode

Stoichiometric Effect of Sb 2 Te 3 Thin Film on Thermoelectric Property