Abstract:Thermoelectric materials have a wide range of application because they can be directly used in refrigeration and power generation. And the Bi2Te3 stand out because of its excellent thermoelectric performance and are used in commercial thermoelectric devices. However, n-type Bi2Te3 has seriously hindered the development of Bi2Te3-based thermoelectric devices due to its weak mechanical properties and inferior thermoelectric performance. Therefore, it is urgent to develop a high-performance n-type Bi2Te3 polycrystalline. In this work, we employed interstitial Cu and the hot deformation process to optimize the thermoelectric properties of Bi2Te2.7Se0.3, and a high-performance thermoelectric module was fabricated based on this material. Our combined theoretical and experimental effort indicates that the interstitial Cu reduce the defect density in the matrix and suppresses the donor-like effect, leading to a lattice plainification effect in the material. In addition, the two-step hot deformation process significantly improves the preferred orientation of the material and boosts the mobility. As a result, a maximum ZT of 1.27 at 373 K and a remarkable high ZTave of 1.22 across the temperature range of 300−425 K are obtained. The TEG (7-pair) and TEC (127-pair) modules were fabricated with our n-type textured Cu0.01Bi2Te2.7Se0.3 coupled with commercial p-type Bi2Te3. The TEC module demonstrates superior cooling efficiency compared to the commercial Bi2Te3 device, achieving a ΔT of 65 and 83.4 K when the hot end temperature at 300 and 350 K, respectively. In addition, the TEG module attains an impressive conversion efficiency of 6.5% at a ΔT of 225 K, which is almost the highest value among the reported Bi2Te3-based TEG modules.

Effect of Plating Layers on the Bonding Strength of p-Type Bi-Te Thermoelectric Elements

Diffusion bonding at the interface of Bi2Te3 thermoelectric modules

Ni barrier in Bi2Te3-based thermoelectric modules for reduced contact resistance and enhanced power generation properties

Ni–W–P layer-induced strength improvement of solder joint in Bi2Te3 thermoelectric module

Enhanced Thermoelectric and Mechanical Properties of p-type Bi0.5Sb1.5Te3 Bulk Alloys by Composite Electroless Plating with Ni&Cu

Bonding and Interfacial Reaction Between Ni Foil and N-Type Pbte Thermoelectric Materials for Thermoelectric Module Applications

Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System

Realizing High-Efficiency Thermoelectric Module by Suppressing Donor-Like Effect and Improving Preferred Orientation in N-Type Bi2(Te, Se)3

Interfacial Stability in Bi2Te3 Thermoelectric Joints

Bonding and High-Temperature Reliability of NiFeMo Alloy/n-Type PbTe Joints for Thermoelectric Module Applications

Enhanced Contact Performance and Thermal Tolerance of Ni/Bi2Te3 Joints for Bi2Te3-Based Thermoelectric Devices

Effect of NiMo Diffusion Barrier Plating Preparation on Microstructure and Properties of Bi2Te3/Cu Joints

EFFECT OF OPERATING TEMPERATURE ON INTERFACE DIFFUSION AND POWER GENERATION OF BISMUTH TELLURIDE THERMOELECTRIC MODULES

Effects of Electroless Plating with Cu Content on Thermoelectric and Mechanical Properties of p-type Bi0.5Sb1.5Te3 Bulk Alloys

Thermoelectric Performance Enhancement in N -Type Bi 2 (tese) 3 Alloys Owing to Nanoscale Inhomogeneity Combined with a Spark Plasma-Textured Microstructure

Improved contact performance and thermal stability of Co–Ni alloy barrier layer for bismuth telluride-based thermoelectric devices

Surface Modification of Bi2Te3 Nanoplates Deposited with Tin, Palladium, and Tin/Palladium Using Electroless Deposition

Extremely Low Contact Resistivity of Bi 2 Te 3 -Based Modules Enabled by NiP-Based Alloy Barrier

Mechanically Enhanced P- and N-Type Bi2Te3-based Thermoelectric Materials Reprocessed from Commercial Ingots by Ball Milling and Spark Plasma Sintering

Fabrication and Excellent Performances of Bismuth Telluride-Based Thermoelectric Devices.

Interfacial Reactions between Sn-Based Solders and n-Type Bi2(Te,Se)3 Thermoelectric Material