Abstract:To achieve high-performance thermoelectric (TE) devices, constructing a good interfacial connection between TE materials and electrodes is as important as having high figure-of-merit TE materials. Although CoSb3-based TE devices have received great attention for power generation recently, the limited long-term service stability is the main obstruct for their applications. In this work, we have prepared two kinds of Ti-based alloys (Ti83.7Al10.7Si5.6 and Ti74Ni26) as the diffusion barrier layer of CoSb3-based TE joints by the spark plasma sintering method and have systematically investigated their interfacial behaviors during the aging process. The performances of contact resistivity and mechanical strength for Ti74Ni26/Yb0.4Co3.8Fe0.2Sb12 TE joints are good before aging treatment but gradually deteriorate during the aging process, which should be ascribed to the phase-transition-induced negative thermal expansion in Ti-Ni alloys. On the other hand, Ti83.7Al10.7Si5.6/Yb0.4Co3.8Fe0.2Sb12 TE joints show both low contact resistivity (<10 μΩ·cm2) and high mechanical strength (>20 MPa) before and after 16-day aging at 500 °C, which is originated from the matching of the coefficient of thermal expansion (CTE) and the formation of network structures in Ti-Al-Si alloys. We have also prepared an eight-couple TE module of p-Ge0.9Sb0.1TeB0.01/n-Yb0.4Co3.8Fe0.2Sb12 and have measured its corresponding device performance. Our work has demonstrated that the matched CTE and network structures in the Ti-Al-Si alloy are key to obtain high-performance CoSb3-based TE joints for long-term service.

Interfacial Reaction and Shear Strength of SnAgCu/Ni/Bi2Te3-Based TE Materials During Aging

Interfacial Reaction and Shear Strength of SnAgCu/Ni/Bi 2 Te 3 -Based TE Materials During Aging

Ni barrier in Bi2Te3-based thermoelectric modules for reduced contact resistance and enhanced power generation properties

Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints under Shear Loading

Enhanced Interfacial Reliability and Mechanical Strength of CoSb3-Based Thermoelectric Joints with Rationally Designed Diffusion Barrier Materials of Ti-Based Alloys

Enhanced Contact Performance and Thermal Tolerance of Ni/Bi2Te3 Joints for Bi2Te3-Based Thermoelectric Devices

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Interfacial Reactions and Microstructural Evolution of BGA Structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu Mixed Assembly Joints During Isothermal Aging

Microstructural evolution and failure mechanism dominated by Bi, Sb cooperative diffusion at p-type thermoelectric pillar Bi-Sb-Te/Sn interface

Effect of NiMo Diffusion Barrier Plating Preparation on Microstructure and Properties of Bi2Te3/Cu Joints

Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System

Microstructural Evolution And Mechanical Behavior Of Line-Type Ni/Sn3.0ag0.5cu/Ni Interconnects With A Small Thickness During Isothermal Aging

Effect of thermal aging on microstructure, shear and mechanical shock failures for solder ball bonding joint

Evidences for diffusion-induced phase evolution and crack generation of intermetallic at Bi 2 Te 3 /Sn interface of thermoelectric generator electrode

Microstructure Evolution and Mechanical Properties of Cu/Sn/Ag TLP-bonded Joint During Thermal Aging

Interfacial Stability in Bi2Te3 Thermoelectric Joints

Effects of aging time and temperature on shear properties of Sn–Zn and Sn–Ag–Cu solder joints

Effects of aging on structures and shear strength of interface of Sn-Ag-Cu solder/Ni-P plating layer

Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging

Investigation of Isothermal Aged Sn-3Ag-0.5Cu/Sn58Bi-Co Hybrid Solder Joints on ENIG and ENEPIG Substrate with Various Mechanical Performances

Interfacial Reactions in Ni/Se-90 At.%te and Ni/Pb1-xSnxSe Couples