Abstract:Bismuth telluride-based thermoelectric (TE) devices were widely used in waste heat recovery due to their high thermoelectric figure of merit (ZT), but the severe diffusion between Sn-based solder and TE pillar generated porous and brittle Sn-Te intermetallic compound (IMC), which seriously restricted the reliable service of devices. Ni-based coating was used but the thick Ni-Te IMC also impaired the properties of TE pillars. In this work, the crystalline Co-P coating was inserted between the p-type TE material Bi 0.5 Sb 1.5 Te 3 and the solder by electrodeposition, and the power generation sustainability of the TE pillar were significantly improved, and the mechanism was revealed. The microstructural characterization proved that the Co-P coating could effectively resist the diffusion of active Sn, Bi, Sb, Cu atoms. Co-P coating would provide support for the structural integrity and performance sustainability of TE pillars. It was worth noting that an ultrathin CoTe 2 IMC layer was formed between the Co-P coating and the Bi-Sb-Te pillar, which was much thinner than the Ni-Te IMC layer reported in the literature. This indicated that Co-P only consumed little thermoelectric elements, but also a good metallurgical bond was formed between the Co-P and the Bi-Sb-Te. After aging at 423 K for 150 h, the maximum output power and average Seebeck coefficient of the TE pillar without coating dropped significantly by 74% and 34%, respectively, and the internal resistance rose by 67%. Remarkably, the maximum output power and average Seebeck coefficient of the TE pillar protected by the Co-P coating only decreased by 14% and 5%, respectively, and the internal resistance only increased by 6%.

Evidences for diffusion-induced phase evolution and crack generation of intermetallic at Bi 2 Te 3 /Sn interface of thermoelectric generator electrode

Microstructural evolution and failure mechanism dominated by Bi, Sb cooperative diffusion at p-type thermoelectric pillar Bi-Sb-Te/Sn interface

Ni barrier in Bi2Te3-based thermoelectric modules for reduced contact resistance and enhanced power generation properties

Interfacial Reaction and Shear Strength of SnAgCu/Ni/Bi 2 Te 3 -Based TE Materials During Aging

Interfacial Reaction and Shear Strength of SnAgCu/Ni/Bi2Te3-Based TE Materials During Aging

Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System

EFFECT OF OPERATING TEMPERATURE ON INTERFACE DIFFUSION AND POWER GENERATION OF BISMUTH TELLURIDE THERMOELECTRIC MODULES

Enhancing power generation sustainability of thermoelectric pillars by suppressing diffusion at Bi-Sb-Te/Sn electrode interface using crystalline Co-P coatings

Screening metal diffusion barriers for thermoelectric Bi0.5Sb1.5Te3

Enhanced Interfacial Reliability and Mechanical Strength of CoSb3-Based Thermoelectric Joints with Rationally Designed Diffusion Barrier Materials of Ti-Based Alloys

Interfacial Stability in Bi2Te3 Thermoelectric Joints

Evaluation of Electroplated Co-P Film as Diffusion Barrier Between In-48Sn Solder and SiC-Dispersed Bi 2 Te 3 Thermoelectric Material

Evolution of the Intrinsic Point Defects in Bismuth Telluride-Based Thermoelectric Materials

A general design strategy for thermoelectric interface materials in n-type Mg3Sb1.5Bi0.5 single leg used in TEGs

Interfacial Reactions between Sn-Based Solders and n-Type Bi2(Te,Se)3 Thermoelectric Material

Diffusion bonding at the interface of Bi2Te3 thermoelectric modules

High performance of Bi2Te3-based thermoelectric generator owing to pressure in fabrication process

Cubic phase stabilization and thermoelectric performance optimization in AgBiSe 2 –SnTe system

Al-Si Alloy as a Diffusion Barrier for GeTe-Based Thermoelectric Legs with High Interfacial Reliability and Mechanical Strength

Atomic-Resolution Interfacial Reaction Mechanism between Bi 2 Te 3 -Based Alloys and Ni Electrodes

Interface and Surface Engineering Realized High Efficiency of 13% and Improved Thermal Stability in Mg3Sb1.5Bi0.5‐Based Thermoelectric Generation Devices