Screening metal diffusion barriers for thermoelectric Bi0.5Sb1.5Te3

Min Liu,Wen Li,Yanzhong Pei

DOI: https://doi.org/10.1007/s40843-023-2696-1

2024-01-03

Science China Materials

Abstract:As the only commercialized thermoelectric for low-grade waste heat recovery applications, Bi 2 Te 3 -based devices commonly use nickel as the electrode. The long-term chemical stability of the Bi 2 Te 3 /Ni junction, particularly for the hot side, is one of the major concerns for Bi 2 Te 3 -based and other thermoelectrics because of the formation of Ni-Te intermediate compounds. The utilization of diffusion barrier layers has been proven to be an effective solution and the barriers should have both a good chemical inertness and a slow diffusion. In this work, Ti was screened out from 13 metals in total as an effective barrier material between p-type Bi 0.5 Sb 1.5 -Te 3 thermoelectric materials and Ni electrodes, because of its low diffusion coefficient and long-term interfacial stability. The fabricated p-type Bi 0.5 Sb 1.5 Te 3 /Ti/Ni single-leg devices show a conversion efficiency over 6%, at a temperature difference of 200 K, without observable degradation for 1860 cycles of measurements lasting for 10 days. This study offers a useful strategy for making efficient and durable thermoelectric devices.

materials science, multidisciplinary