Short-Circuit Characterization and Protection of 10-kV SiC mosfet

Shiqi Ji,Marko Laitinen,Xingxuan Huang,Jingjing Sun,William Giewont,Fei Wang,Leon M. Tolbert
DOI: https://doi.org/10.1109/tpel.2018.2834463
IF: 5.967
2019-02-01
IEEE Transactions on Power Electronics
Abstract:This paper presents the characterization of the temperature-dependent short-circuit performance of a Gen3 10kV20A silicon carbide (SiC) mosfet. The test platform consisting of a phase-leg configuration and a fast speed 10-kV solid state circuit breaker, with temperature control, is introduced in detail. A novel FPGA-based short-circuit protection circuit having a response time of 1.5s is proposed and integrated into the gate driver. The short-circuit protection is validated through the platform. The short-circuit characteristics for both the hard switching fault and fault under load (FUL) types at various dc-link voltages (from 500V to 6kV) are tested and discussed. The saturation current increases with dc-link voltage and achieves 360A at 6kV. Different from low voltage SiC devices, there is no current spike in FUL type of fault. The temperature-dependent short-circuit performance is also presented from 25 to 125C. The difference of short-circuit waveforms at various initial junction temperatures can be neglected. A thermal model of the 10-kV SiC mosfet is built for the junction temperature estimation during the short circuit and for analysis of the initial junction temperature impact on the short-circuit performance.
engineering, electrical & electronic
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