Temperature dependence of strain in Al/sub x/Ga/sub 1-x/N/GaN heterostructures

D.J. Chen,B. Shen,K.X. Zhang,Y.Q. Tao,X.S. Wu,J. Xu,R. Zhang,Y.D. Zheng
DOI: https://doi.org/10.1109/sim.2005.1511387
2004-01-01
Abstract:The temperature dependence of strain in a 50-nm- and a 100-nm-thick Al/sub 0.2/Ga/sub 0.8/N/GaN heterostructures were investigated at temperatures 300-800 K. The results show that the temperature behavior of the in-plane strain in the 50-nm-thick AlGaN layer is different to that in the 100-nm-thick AlGaN layer. There exists an initial energy barrier to the strain relaxation for the 50-nm-thick Al/sub 0.22/Ga/sub 0.78/N/GaN heterostructure. Meanwhile, for both the 50-nm-and 100-nm-thick AlGaN layers the strain relaxation becomes saturated at the high temperature segment, although the temperature at the point of saturation is different. The total strain relaxation is less than 5% for both the 50-nm- and 100-nm-thick Al/sub 0.22/Ga/sub 0.78/N layers at whole temperature range in our measurements.
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