Influences of AlN passivation dielectric on AlGaN/GaN heterostructure and its high-temperature properties

Chen Guo-qiang,Chen Dun-jun,Liu Bin,Xie Zi-li,Han Ping,Zhang Rong
DOI: https://doi.org/10.3969/j.issn.1007-4252.2008.06.016
2008-01-01
Abstract:The influences of AlN passivation dielectric on the strain change of the AlGaN barrier layer and the high-temperature transport properties of AlGaN/GaN heterostructure have been investigated in the present work.The results show that the AlN passivation layer will induce an additional biaxial compressive strain to AlGaN barrier layer.Both the AlN and traditional Si3N4 passivation dielectrics can mitigate temperature-dependent strain relaxation of the AlGaN barrier,and AlN displayed a better effect.Compared to the traditional Si3N4 dielectric,the AlN film led to an obvious increase not only in the concentration but also in the mobility of the two dimensional electron gas(2DEG) in AlGaN/GaN heterostructure.Meanwhile,the variation of the 2DEG concentration with temperature in the AlN passivated sample is also smaller in comparison with that in the Si3N4 passivated sample.All these indicate that the AlN film is a promising passivation dielectric for AlGaN/GaN heterostructure devices.
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