High-Temperature Characteristics of Strain in AlGaN/GaN Heterostructures

Dunjun Chen,Bo Shen,Kaixiao Zhang,Yaqi Tao,Xiaoshan Wu,Jing Xu,Rong Zhang,Youdou Zheng
DOI: https://doi.org/10.1143/JJAP.45.18
2006-01-01
Abstract:The high-temperature characteristics of strain in fully strained and partially strain-relaxed Al0.2Ga0.8N/GaN heterostructures were investigated at temperatures from room temperature to 800K by means of the high-resolution X-ray diffraction technique. The results show that an obvious temperature-dependent strain relaxation occurs in both 50-nm- and 100-nm-thick AlGaN layers when the temperature exceeds 523 K. The degree of strain relaxation increases by about 12% and 15% in 50-nm- and 100-nm-thick AlGaN layers, respectively, over the whole temperature range in our measurements. The temperature-dependent strain relaxation results in a theoretical 2DEG reduction of about 5 and 6% for the fully strained and partially strain-relaxed Al0.22Ga0.78N/GaN heterostructures, respectively. When the temperature is under 523 K, the in-plane strain in the 50-nm-thick AlGaN layer is stabler than that in the 100-nm-thick AlGaN layer due to a lower density of dislocations in the 50-nm-thick AlGaN layer.
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