Growth of Thick Ge Epitaxial Layers with Low Dislocation Density on Silicon Substrate by UHV/CVD

Zhou Zhiwen,Cai Zhimeng,Zhang Yong,Cai Kunhuang,Zhou Bi,Lin Guijiang,Wang Jianyuan,Li Cheng,Lai Hongkai,Chen Songyan,Yu Jinzhong,Wang Qiming
DOI: https://doi.org/10.3321/j.issn:0253-4177.2008.02.023
2008-01-01
Journal of Semiconductors
Abstract:Thick Ge epitaxial layers are grown on Si(001) substrates with low temperature buffer layers with ultra-high vacuum chemical vapor deposition systems using Si2H6 and GeH4 as precursors.The deposition process of the Ge layer on Si is investigated in real time by reflection high-energy electron diffraction, and the quality of the Ge layer was evaluated by atomic force microscopy, double crystal X-ray diffraction (XRD), and Raman measurement.The root-mean-square surface roughness of the Ge epilayer with a thickness of 550nm is less than 1nm and the full-width-at-half maximum of the Ge peak of the XRD profile and the Ge-Ge mode of the Raman spectra are about 530 and 5.5cm-1, respectively.These measurements indicate that the Ge epitaxial layer is of good quality.The etch pit density related to threading dislocations is less than 5e5cm-2.This is a promising material for Si-based long wavelength photodetectors and electronic devices
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