Fabrication and Characteristics of Ni-Germanide Schottky Contacts with Ge

DD Han,XY Liu,JF Kang,ZL Xia,G Du,RQ Han
DOI: https://doi.org/10.1088/1009-1963/14/5/033
2005-01-01
Chinese Physics
Abstract:In this study, Ni germanide Schottky barrier diodes on n-Ge (100) substrate were fabricated by sputtering metal Ni on Ge, followed by annealing in N2 atmosphere from 300 to 500 degrees C in a furnace. The results of x-ray diffraction (XRD) show that the Ni germanide was formed and the diffraction line of (111) was observed in all samples. The structure of Ni germanide is orthorhombic with lattice parameters a=5.811, b=5.381, c=3.428. However, the lines (121) and (002) were observed only in the samples annealed at a temperature higher than 400 degrees C. The influence of annealing temperature on the electrical properties of Ni germanide Schottky barrier diodes on n-Ge (100) substrate was investigated. Experimental results indicated that Schottky barrier diodes on n-Ge (100) with current–voltage (I–V) rectifier characteristics were obtained. The Ion/Ioff ratio of the Schottky diode obtained by using a 300 degrees C annealing process is the highest. The Schottky barrier heights were evaluated by the capacitance–voltage method.
What problem does this paper attempt to address?