Solid-Phase Reaction Between Co, Ni/n-poly-Si0.84Ge0.16 and Schottky Barrier Properties of the Formed Contacts

王光伟,茹国平,屈新萍,李炳宗
DOI: https://doi.org/10.3969/j.issn.1003-353X.2004.11.012
2004-01-01
Abstract:Amorphous Si0.86Ge0.14 thin film was deposited by ion beam sputtering (IBS)technique. It was doped with phosphorus through thermal diffusion to fabricate n-poly-Si0.84Ge0.16layer. Co and Ni were deposited respectively on n-poly-Si0.84Ge0.16 layer by IBS method to investi-gate solid-phase reaction between Co, Ni and n-poly-Si0.84Ge0.16, as well as their Schottky contactproperties. The I-V characteristics of both as-deposited and annealed Schottky junctions weremeasured at room temperature. The results indicate that the Schottky barrier heights (SBHs) keepnearly constant with the annealing temperature between 300 and 600 ℃.
What problem does this paper attempt to address?