Abstract:In the present work, under the theoretical framework of interface fracture mechanics, the interfacial delamination of molded underfill (MUF) encapsulated flip-chip (FC) packages is studied intensively by means of finite element simulation via virtual crack closure technique (VCCT). The crack propagation driving force, in terms of the strain energy release rate (SERR) is calculated by finite element analyses. Then, the components of Mode I strain energy release rate (G II ) and Mode II strain energy release rate (G II ) are used to determine complex stress intensity factors (SIFs) and the associated phase angle at the interface. However, due to the oscillatory nature of the stresses at the crack tip, the results of Gi and Gn are usually not converging when the element size decreases by using VCCT. Thus, the mesh independent technology must be used to evaluate the phase angle in interface crack analysis. To this end, four different methods, which are independent of parameter Δ (i.e., the crack extension size used in VCCT), are adopted to obtain the phase angle. Meanwhile, the values of the phase angle and SERR subjected to different thermal histories are calculated and the differences among these values are compared. It is found that the zero-stress temperature of the molded underfill flip-chip (MUF FC) package is very important for obtaining reasonable and correct simulation results, in particular, below this temperature the crack tip penetration occurs between the upper and lower surfaces of an embedded crack at the interface. A frictionless contact pair should be applied so as to prevent the inter-penetration of the crack. Whereas above the zero-stress temperature, no inter-penetration occurs. So, there is no need to apply the contact pair to calculating phase angles and SIFs. Furthermore, the effect of viscoelasticity of MUF on the delamination driving force in packages has also been investigated, which shows that the viscoelasticity can effectively alleviate the delamination driving force in MUF encapsulated FC packages.

The Energy Release Rate of the Micro-Cracks in a Ultralow-K Chip During the Flip Chip Process

Fractures of Ultra-Low-k Material in a Chip During a Flip-Chip Process

The Stress Analysis and Parametric Studies for the Low-K Layers of a Chip in the Flip-Chip Process.

Stress Modeling for the Impacts of Flip Chip Process on the Ultralow-K Chips

Thermal Stress Analysis of the Low-K Layer in a Flip-Chip Package

Assess Low-K/ultralow-k Materials Integrity by Shear Test on Bumps of a Chip

Thermal Stress Analysis for the Low-k Dielectric Layers of Cu Interconnects in a 45 nm Chip

The Characterization of Low-K Thin Films and Their Fracture Analysis in a WLCSP Device

Fractures of Low-K Materials in a RF Package with Integrated Passive Device Based on TGV

Failure Mechanism Study for Flip Chip QFN Crack Issue under Temperature Cycling Test

Measuring the Fracture Toughness of Low-K Thin Films Used in Advanced Packaging

Reliable Peeling of Ultrathin Die with Multineedle Ejector

Microcracking in On-Chip Interconnect Stacks: FEM Simulation and Concept for Fatigue Test

Competing Fracture Modeling of Thin Chip Pick-Up Process

Study on the mechanical properties of ultra-low dielectric film by tensile test

Microscopic Analysis by EBSD Method on Fatigue Crack Propagation Behaviour in Ultrafine-Grained Copper

Study on BEOL Failures in a Chip by Shear Tests of Copper Pillar Bumps

Critical Ultra Low-K Tddb Reliability Issues For Advanced Cmos Technologies

Three-dimensional Finite Element Analysis of Interfacial Delamination in Molded Underfill Flip-Chip Packages by Virtual Crack Closure Technique

An Extensive Simulation Study of the Interfacial Delamination in Molded Underfill Flip-Chip Packages by Finite Element Method Based on Virtual Crack Closure Technique

Finite Element Simulation Study of Interfacial Crack Propagation in the Underfilled FC-BGA Package