Abstract:The advent of three-dimensional stacked chips has significantly enhanced overall performance but introduced challenges in thermal analysis. To ensure the reliable operation of stacked chips and improve the design efficiency of heat sinks, a comprehensive exploration of thermal management issues, the formulation of practical thermal design principles, and the development of a foundational heat transfer analysis model are imperative. In this study, a three-dimensional stacked module is modeled using FloTHERM finite element simulation technology, and its temperature profile is subsequently simulated. The thermal resistance value of the module's shell is calculated to be 37.25 °C W −1 . Subsequently, utilizing the instantaneous state dual interface method, the junction-to-case thermal resistance of the module is experimentally measured using T3ster equipment. Two identical modules are tested, revealing a junction-to-case resistance value of 39.45 °C W −1 for module No. 1 and 40.50 °C W −1 for module No. 2—both approximately 40 °C W −1 , thereby validating the accuracy and repeatability of the tests. A comparative analysis between the simulated and experimental thermal resistance values indicates an error of approximately − 5.5% for module 1 and − 8.0% for module 2. Further analysis suggests potential sources of error, such as thermal conductivity of the plastic packaging material and hot spot distribution. The paper concludes with simulation-based analyses of plastic packaging material thermal conductivity and hot spot distribution, offering insights for refining the simulation model. This study verifies the correctness of the results obtained by using finite element analysis to build a model for thermal simulation analysis. It has reference value for the thermal simulation analysis and thermal resistance test method of 3D integrated package module.

Thermal Stress Analysis of the Low-K Layer in a Flip-Chip Package

Thermal Stress Analysis for the Low-k Dielectric Layers of Cu Interconnects in a 45 nm Chip

The Stress Analysis and Parametric Studies for the Low-K Layers of a Chip in the Flip-Chip Process.

Stress Modeling for the Impacts of Flip Chip Process on the Ultralow-K Chips

Modeling Simplification for Thermal Mechanical Stress Analysis of TSV Interposer Stack

Simulation and Experimental Analysis of Thermomechanical Stress Around Interconnects for W2W Hybrid Bonding

Fractures of Ultra-Low-k Material in a Chip During a Flip-Chip Process

The Characterization of Low-K Thin Films and Their Fracture Analysis in a WLCSP Device

The Energy Release Rate of the Micro-Cracks in a Ultralow-K Chip During the Flip Chip Process

Thermal Stress and Reliability Analysis of TSV-Based 3-D ICs with a Novel Adaptive Strategy Finite Element Method

Assess Low-K/ultralow-k Materials Integrity by Shear Test on Bumps of a Chip

Stress Analysis of Cu/low-k Interconnect Structure During Whole Cu-CMP Process Using Finite Element Method.

A Comprehensive study of reliability improvement for 65nm Cu/Low-k process

Simulation and experiments of stress migration for Cu/low-k BEoL

Exploring modeling and testing approaches for three-dimensional integrated thermal resistance of chiplets

Influences of Material and Structural Factors on the Stress Conditions in Cu/low-k Chips During Cu Wire Bonding

Stress modeling of Cu/low-k BEoL - application to stress migration

Overview and applicability of residual stress estimation of film–substrate structure

Thermal contact analysis of Flip-Chip package considering microscopic contacts of double-layer thermal interface materials

Temperature Rise in Low-K ULSI Interconnects

A Framework for Layout-Dependent STI Stress Analysis and Stress-Aware Circuit Optimization