Abstract:In this work, a method is introduced which enables the evaluation of the influence of cyclical mechanical stress on the back end of line (BEoL) stack by applying shear load to single adjacent Copper (Cu-)pillars. This method is a subsequent development of previous work [1]. The objective of the approach presented in this work is to realize micromechanical loading scenarios which emulate application conditions more precisely compared to e.g. pure shear testing [1],[2],[3] or bump assisted BEoL stability indentation (BABSI) testing [4]. These methods are designed to evaluate the mechanical robustness of the BEoL stack and analyze the occurring damage processes, but they do not mimic the actual load conditions of a flip chip (FC) soldered die in which the Cupillars are immobilized by solder joints and, to a lesser extent, the underfill. In this work, a micromechanical loading approach is introduced which creates a loading situation which is closer to the actual application scenario. A customized indenter tip was utilized to provide the immobilization of single Cu-pillars and load them micromechanically. In a first approach, Cu-pillar shear-off experiments were performed in order to identify the maximum shear force before delamination and the related damage mode. In a second step, sub-critical cycling loading experiments were performed on single Cu-pillars to emulate the change of shear force direction as it can also occur in the field and evaluate the effect on the BEoL stack. Acoustic Emission (AE) measurements were utilized as a damage indicator during mechanical loading. The damage analysis was conducted utilizing nano X-ray computed tomography (nXCT) and scanning electron microscopy (SEM) including the imaging of focused ion beam (FIB) milled cross sections. The identified damages are mainly a deformation of the Aluminum contact pad and the polyimide (PI) surface passivation. However, also cracking could be identified which progressed through the Aluminum pad into the BEoL stack. The crack path is mostly defined by the layout of the Copper grid in the uppermost layers of the BEoL stack. The presence of Copper can deflect cracks and prevent the penetration of the BEoL stack. For this reason, the most severe damages, i.e. the deepest penetration of the BEoL stack, were detected in areas where gaps in the grid of the two uppermost metallization layers are located directly above each other.

Assess Low-K/ultralow-k Materials Integrity by Shear Test on Bumps of a Chip

Study on BEOL Failures in a Chip by Shear Tests of Copper Pillar Bumps

Fractures of Ultra-Low-k Material in a Chip During a Flip-Chip Process

The Stress Analysis and Parametric Studies for the Low-K Layers of a Chip in the Flip-Chip Process.

Effects of shear test temperatures and conditions on mechanical properties of Sn–Ag flip-chip solder bumps

Study on the mechanical properties of ultra-low dielectric film by tensile test

The Energy Release Rate of the Micro-Cracks in a Ultralow-K Chip During the Flip Chip Process

Transient Electrothermal Analysis of Multilevel Interconnects in the Presence of ESD Pulses Using the Nonlinear Time-Domain Finite-Element Method

The Characterization of Low-K Thin Films and Their Fracture Analysis in a WLCSP Device

A tensile test for freestanding low-k thin films using a lift-off technique

Thermal Stress Analysis of the Low-K Layer in a Flip-Chip Package

Fractures of Low-K Materials in a RF Package with Integrated Passive Device Based on TGV

Thermal Stress Analysis for the Low-k Dielectric Layers of Cu Interconnects in a 45 nm Chip

Measuring the Fracture Toughness of Low-K Thin Films Used in Advanced Packaging

Mechanical Properties of the Low-K Material Measured by Tensile Tests

Mechanical BEoL Stability Investigation at Cu-Pillars under Cyclic Load

Study on Shear Strength and Jc of EMC/Cu Interface with Cu Oxidation and Moisture Absorption

Simulation and experiments of stress migration for Cu/low-k BEoL

Internal Bump Cracking Risk Assessment for Flip Chip Ball Grid Array Package During Board Level Reliability Test Through Finite Element Analysis

Multi-Scale Mechanical Probing Techniques To Investigate The Stability Of BEOL Layer Stacks With Sub-100 nm Structures

The study of bare-die FCBGA die damage in response to applied mechanical stress during heat sink assembly