Abstract:Freestanding ultra‐thin nanocrystalline gold films are directly tested on water surface and observed in situ to systematically evaluate the intrinsic plane stress fracture toughness. Quantitative thickness‐dependent trend is clarified and microstructural analysis elucidate the mechanism. Validations based on linear elastic fracture mechanics theory propose the method as a new standard for revealing the fracture behavior of sub‐100 nm thick films. Fracture toughness, which is the resistance of a material to crack propagation, is a critical material property for ensuring the mechanical reliability of damage‐tolerant design. Recently, damage‐tolerant design is introduced to flexible electronics by adopting micro‐cracked ultra‐thin nanocrystalline (NC) gold films as stretchable electrodes in a plane stress state. However, experimental investigation of the plane stress fracture toughness of those films remains challenging due to the intrinsic fragility from their sub‐100 nm thicknesses. Here, a quantitative method for systematically evaluating the plane stress fracture toughness of freestanding ultra‐thin NC gold film on water surface platform is presented. After effectively fabricating single‐edge‐notched‐tension samples with femtosecond laser, mode I stress intensity factors are measured in the plane stress state on water surface. Moreover, investigation regarding the effect of notch length, notch sharpness, and notch tip plasticity validates this method based on linear elastic fracture mechanics theory. As a demonstration, the thickness‐dependent plane stress fracture toughness of ultra‐thin NC gold films is qualitatively unveiled. It is revealed that the thickness confinement effect on grain boundary sliding induces a transition in fracture behavior. This method is expected to further clarify the fracture‐related properties of various ultra‐thin films for next‐generation electronics.

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A tensile test for freestanding low-k thin films using a lift-off technique

Fractures of Low-K Materials in a RF Package with Integrated Passive Device Based on TGV

Mechanical Properties of the Low-K Material Measured by Tensile Tests

Study on the mechanical properties of ultra-low dielectric film by tensile test

Investigation on the Compressive Mechanical Properties of Ultra-Thick CFRP Laminates

Directly Probing the Fracture Behavior of Ultrathin Polymeric Films

Fractures of Ultra-Low-k Material in a Chip During a Flip-Chip Process

Micro-Scale Delaminating and Buckling of Thin Film on Soft Substrate

The Energy Release Rate of the Micro-Cracks in a Ultralow-K Chip During the Flip Chip Process

Deformation and Fracture Mechanisms of Automated Fiber Placement Pre-Preg Laminates under Out-of-plane Tensile Loading

Plane Stress Fracture Toughness Testing of Freestanding Ultra‐Thin Nanocrystalline Gold Films on Water Surface

Adhesion study of low-k/Si system using 4-point bending and nanoscratch test

Stress Analysis of Cu/low-k Interconnect Structure During Whole Cu-CMP Process Using Finite Element Method.

Assess Low-K/ultralow-k Materials Integrity by Shear Test on Bumps of a Chip

Study on the Delamination Between Adhesive Film and Silicon in Stacked-Die Packaging

Thermal Stress Analysis of the Low-K Layer in a Flip-Chip Package

Mechanical Properties and Interface Characteristics of Nanoporous Low-K Materials.

The Stress Analysis and Parametric Studies for the Low-K Layers of a Chip in the Flip-Chip Process.

Investigation of Defect Formation in Porous Ultra Low K Film (k=2.5) for 28nm Technological Node