Microcracking in On-Chip Interconnect Stacks: FEM Simulation and Concept for Fatigue Test

Stefan Weitz,André Clausner,Ehrenfried Zschech

DOI: https://doi.org/10.1007/s11664-024-11091-z

IF: 2.1

2024-05-11

Journal of Electronic Materials

Abstract:The semiconductor industry is continuing the scaling down of both device and on-chip interconnect features, for performance and economic reasons. This trend has implications for the design of guard ring structures, i.e. metallic non-functional structures in the back-end-of-line (BEoL) stack designed to be efficient to stop microcracks. In this work, we present a sample design for an in situ experiment to study mechanical degradation and failure mechanisms of crack stop structures in the BEoL stack, to ensure the mechanical robustness of microchips for future technology nodes. Additional finite element method (FEM) simulations provide supplementary understanding of the crack kinetics. To examine the effects of mechanical loading on crack stop elements of the BEoL stack, a novel sample geometry for an in situ fatigue experiment using x-ray microscopy was developed. The x-ray microscope (ZEISS Xradia 800 Ultra) enables high-resolution imaging of the 3D-patterned sample structures and defects such as microcracks. The tailored sample geometry allows the application of a tensile load to a BEoL specimen by a lever mechanism. The feasibility of the sample design is shown by mode-I loading of a pure interconnect sample. Post-mortem analysis by scanning electron microscopy (SEM), confirming planar microcrack propagation from the notch through the dielectric layer with small deflections of the crack path near cone shaped copper vias. FEM simulations focusing on the stress-strain fields around a crack tip indicate the beginning of copper plasticity as major mechanism starting the redirection of cracks due to resulting material compression in front of the obstacle.

engineering, electrical & electronic,materials science, multidisciplinary,physics, applied

What problem does this paper attempt to address?

### Problems Addressed by the Paper

This paper aims to address the issue of mechanical degradation and failure mechanisms of microcracks in the back-end-of-line (BEoL) stack of microchips. As the semiconductor industry continues to shrink the size of devices and on-chip interconnect structures to improve performance and cost-effectiveness, this trend poses new challenges for the design of guard ring structures. A guard ring is a non-functional metal structure designed to effectively block the propagation of microcracks to ensure the mechanical robustness of microchips in future process nodes.

Specifically, the paper focuses on the following aspects:

1. **Generation and Propagation of Microcracks**: Microcracks typically originate at the edges of the chip during wafer dicing and may propagate into the BEoL stack, leading to mechanical failure of the chip.
2. **Effectiveness of Guard Ring Structures**: Manufacturers design special guard ring structures to prevent the propagation of microcracks, but existing methods lack evaluation of these structures under controlled loading conditions.
3. **Design of Fatigue Testing**: To simulate cyclic thermomechanical loads in actual use, it is necessary to develop an experimental design capable of pure mode I (tensile cracking) loading and fatigue loading.

### Solution

The paper proposes a new sample design for conducting fatigue tests under in-situ X-ray microscopy to study the generation and propagation of microcracks in the BEoL stack. The main contributions include:

1. **Sample Design**: A new sample geometry was developed that can apply tensile loads to BEoL samples through a lever mechanism, suitable for in-situ X-ray microscopy experiments.
2. **Experimental Validation**: The feasibility of the sample design was validated through pure mode I loading experiments, demonstrating the generation and propagation of microcracks in the BEoL.
3. **Finite Element Analysis**: Finite element method (FEM) was used to simulate the stress-strain field to further understand the stress distribution near the crack tip, particularly the influence of copper plastic deformation on the crack path.

### Conclusion

Through this study, the authors demonstrated the feasibility of the new sample design in generating and propagating microcracks, and achieved high-resolution 3D visualization through in-situ X-ray microscopy. Finite element simulation results indicate that copper plastic deformation plays a key role in the deflection of the crack path. These findings provide an important foundation for understanding and evaluating the performance of guard ring structures in microchips.