Self-Aligned N-Polar GaN/InAlN MIS-HEMTs with Record Extrinsic Transconductance of 1105 Ms/mm

Nidhi,Sansaptak Dasgupta,Jing Lu,James S. Speck,Umesh K. Mishra
DOI: https://doi.org/10.1109/led.2012.2190965
IF: 4.8157
2012-01-01
IEEE Electron Device Letters
Abstract:In this letter, we demonstrate state-of-the-art performance from N-polar GaN/InAlN metal-insulator-semiconductor high-electron mobility transistors (MIS-HEMTs). Self-aligned gate-first process was used for the fabrication of transistors. Graded InGaN and InN contact layers were used to achieve a low ohmic contact resistance of 25 Ω · μm. Excellent dc performance with the highest extrinsic gm of 1105 mS/mm, lowest Ron of 0.29 Ω · mm, and maximum current of 2.77 A/mm was achieved for Lg = 60 nm. The dc performance was found to scale well with the gate length. The highest fT of 155 GHz was obtained for Lg = 30 nm.
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