Fabrication of 150-Nm Al 0.48 in 0.52 As/Ga 0.47 in 0.53 As Mhemts on GaAs Substrates

XiaoFeng Wu,HongXia Liu,HaiOu Li,Qi Li,ShiGang Hu,ZaiFang Xi,Jin Zhao
DOI: https://doi.org/10.1007/s11433-012-4910-7
2012-01-01
Abstract:High performance 150-nm gate-length metamorphic Al0.48In0.52As/Ga0.47In0.53As high electron mobility transistors (mHEMTs) with very good device performance have been successfully fabricated. A T-shaped gate is fabricated by using a combined technique of optical and e-beam photolithography, which is beneficial to decreasing parasitic capacitance and parasitic resistance of the gate. The ohmic contact resistance R c is as low as 0.03 Ω·mm when using a novel ohmic contact metal system (Ni/Ge/Ti/Au). The devices exhibit excellent DC and RF performance. A peak extrinsic transconductance of 775 mS/mm and a maximum drain current density of 720 mA/mm are achieved. The unity current gain cut-off frequency (f T ) and the maximum oscillation frequency (f max) are 188.4 and 250 GHz, respectively.
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