Fabrication of 0.3-μm T-gate metamorphic AlInAs/GaInAs HEMTs on silicon substrates using metal organic chemical vapor deposition

HaiOu Li,Wei Huang,Qi Li,SiMin Li,Xi Jiang,ChakWah Tang,KeiMay Lau,TianWen Zhang
DOI: https://doi.org/10.1007/s11433-012-4658-0
2012-01-01
Abstract:We present an InGaAs metamorphic high electron mobility transistor (mHEMT) grown using Metalorganic Chemical Vapor Deposition (MOCVD) on an n-type silicon substrate with the introduction of an effective multi-stage buffering scheme. Fabrication and performance of a high-frequency 0.3-μm gate-length depletion-mode Al 0.50 In 0.50 As/Ga 0.47 In 0.53 As mHEMT is reported for the first time. Using a combined optical and e-beam photolithography technology, submicron mHEMT devices on Si have been achieved. The non-alloyed ohmic contact resistance R c was as low as 0.065 Ω-mm. A maximum transconductance up to 761 mS/mm was measured. The unity current gain cut-off frequency ( f T ) and the maximum oscillation frequency ( f max ) were 72.8 and 74.5 GHz, respectively. This device has the highest f T yet reported for a 0.3-μm gate-length Si-based mHEMT grown using MOCVD. A high voltage gain, g m / g ds , of 40.6 is observed in the device.
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