High Performance Deep-Submicron Inversion-Mode InGaAs MOSFETs with Maximum G<inf>m</inf> Exceeding 1.1 Ms/µm: New HBr Pretreatment and Channel Engineering

Yanqing Wu,Min Xu,R.S. Wang,O. Koybasi,P. D. Ye
DOI: https://doi.org/10.1109/iedm.2009.5424358
2009-01-01
Abstract:High performance deep-submicron inversion-mode InGaAs MOSFET with ALD Al 2 O 3 as gate dielectric has been demonstrated. Transistors with gate lengths down to 150 nm have been fabricated and characterized. Record high extrinsic transconductance of 1.1 mS/μm has been achieved at V ds = 2.0 V with 5 nm Al 2 O 3 as gate dielectric. G m can be further improved to 1.3 mS/μm by reducing the gate oxide thickness to 2.5 nm at V ds = 1.6 V. HBr pre-treatment, retro-grade structure and halo-implantation processes are introduced for the first time into III-V MOSFET to further improve high-k/InGaAs interface quality and on-state/off-state performance of the devices. The key transistor scaling metrics such as S.S., DIBL, V T of these treated devices are compared with the controlled devices with channel lengths from 250 nm to 150 nm.
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