Behavior of Residual Oxygen in Top Si Layer of SIMOX Studied by PL and SIMS

李映雪,张兴,黄如,王阳元,罗晏
DOI: https://doi.org/10.3969/j.issn.1674-4926.2001.08.011
2001-01-01
Chinese Journal of Semiconductors
Abstract:The crystallization of the top Si layer in SIMOX,especia ll y the behavior of residual oxygen in the top Si layer,is investigated by means o f PL and SIMS,with the sample of P type(100) Si.The results show that there are three peaks in the PL,they are: a peak located at 1 10eV , b peak located at 0 77eV and c peak located at 0 75eV.Comparing with RBS measurement re sults,it is found that the amplitude of the intrinsic peak a in PL and the a mplitude ratio of b peak to a peak are the estimation of crystal perfect ion of the top Si layer of SIMOX wafer.The SIMS results show that the amplitude of b peak is affected by the amount of residual oxygen in the top Si layer of a sample.Peak b is assumed to or iginate from the implantation of oxygen ions and high temperature annealing of S IMOX wafer,which is similar to the phosphorus donor level and plays an important role in making N-type to Si layer of SIMOX from P-type substrate. Meanwhile t he amplitude of c peak depends on the content of nitrogen and carbon in the top Si layer of SIMOX wafer.
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