Soi Structures Produced By Oxygen Ion-Implantation And Their Annealing Behavior

Lr Zheng,Dt Lu,Zl Wang,B Zhang,Plf Hemment
DOI: https://doi.org/10.1016/0168-583X(91)96273-N
1991-01-01
Abstract:SOI (silicon on insulator) samples were produced by large dose (1.8 - 2.5 x 10(18)/cm2) oxygen ion implantation into n- and p-type (100) silicon wafers at an energy of 360-400 keV, after different annealing methods. The SOI structures were measured by IR (infrared) absorption spectroscopy and Hall-effect measurements. After high temperature annealing (1300-degrees-C, 30 min-8 h), we obtain excellent quality SOI films, both the top crystal silicon and the buried SiO2 layer. After a long-time anneal (at 1300-degrees-C), the carrier concentration (electrons) becomes lower and the Hall mobility is higher at 120-300 K in the top silicon.
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