Structural Evolution of A-Si:H/sio 2 Multilayers Upon Step by Step Thermal Annealing

Mei Jia-Xin,Xu Jun,Ma Zhong-Yuan,Zhu-Da,Sui Yan-Ping,Li Wei,Li Xin,Rui Yun-Jun,Huang Xin-Fan,Chen Kun-Ji
DOI: https://doi.org/10.1088/1009-1963/13/8/033
2004-01-01
Chinese Physics
Abstract:a-Si:H/SiO2 multilayers were prepared by alternatively changing plasma enhanced chemical vapour deposition of a-Si:H layers and in situ plasma oxidation process. Subsequently, as-grown samples were annealed at temperatures from 350 degrees C to 1100 degrees C in N2 ambient with an increment of 100 degrees C. The evolution of bonding configurations and structures with annealing treatments was systematically investigated by Fourier-transform infrared spectroscopy. The peak position of Si–O stretching vibration of SiO2 layers shift to 1087cm−1 after annealing at 1100 degrees C, which demonstrates that the SiO2 films fabricated by plasma oxidation after high temperature annealing can have similar properties to the thermal grown ones. A Si–O vibration from interfacial SiOx was identified: the value x was found to increase as increasing the annealing temperature, which is ascribed to the cooperation of hydrogen effusion and reordering of the oxygen bond in SiOx networks. The H-related bonds were observed in the form of H–Si–O3 and H–Si–Si3−nOn (n=1–2) configurations, which are supposed to be present in SiO2 and interfacial SiOx layers, respectively. The H atoms bonded in different bonding configurations effuse at different temperatures due to their different desorption energies.
What problem does this paper attempt to address?