Growth of Epitaxial CoSi2 on SIMOX Material by a Solid-Phase Reaction of Deposited TiN/Co/Ti Layers

P LIU,ZY ZHOU,CL LIN,SC ZOU,RJ ZHANG,BZ LI,PLF HEMMENT
DOI: https://doi.org/10.1016/0168-583x(94)00517-6
1995-01-01
Abstract:Co/Ti bimetallic layers and a TiN capping layer were sequentially deposited on a SIMOX wafer. The influence of the residual oxide on the Si surface was reduced by depositing Ti first. Subsequently an epitaxial CoSi2 film was grown by the interaction of the Co with the Si overlayer of the SIMOX through a multistep anneal in a nitrogen ambient. Both Rutherford backscattering analysis and cross-sectional transmission electron microscopy have shown that a good quality epitaxial growth of CoSi2 with an abrupt interface has been achieved. The interface contained only a few coherent steps which were generated to relax the mismatch strain of the CoSi2 with the Si layer. A minimum channeling yield of 30% was achieved for the epitaxial CoSi2 film. Although the value is higher than that of CoSi2 formed on bulk single-crystalline Si, it is comparatively low for epitaxial CoSi2 growth on the Si(100) overlayer of SIMOX when formed by a solid-phase reaction.
What problem does this paper attempt to address?