Effects of different fabrication processes on stress of SIMOX structure

Meiping Jiang,Jinhua Li,Yiping Huang,Chenglu Lin
1997-01-01
Abstract:The stress of SIMOX samples fabricated by different processes is compared by Raman scattering measurements. The results show that single implantation/annealing and three times implantation/annealing do not evidently affect the stress of SIMOX structures annealed at 1300��C for 6h. The tensile stress densities are uniform and all ��5��103N/cm2; Different annealing atmospheres, such as N2, N2+1%O2, Ar+0.5%O2 do not evidently affect the stress of SIMOX sample as well; Higher stress density (up to 1.25��104N/cm2) is created by part area implantation at the top layer of the SIMOX structure and the stress still remains in the back of the silicon substrate, even after annealing at high temperature for long time.
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